? semiconductor components industries, llc, 2010 july, 2010 ? rev. 3 1 publication order number: mbrd5h100/d mbrd5h100t4g switchmode schottky power rectifier surface mount power package this series of power rectifiers employs the schottky barrier principle in a large metal ? to ? silicon power diode. state ? of ? the ? art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. features ? guardring for stress protection ? low forward voltage ? 175 c operating junction temperature ? epoxy meets ul 94 v ? 0 @ 0.125 in ? short heat sink tab manufactured ? not sheared! ? this is a pb ? free device mechanical characteristics: ? case: epoxy, molded, epoxy meets ul 94 v ? 0 ? weight: 0.4 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl1 requirements ? esd ratings: machine model, c (>400 v) human body model, 3b (>8000 v) maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 100 v average rectified forward current (rated v r ) t c = 171 c i f(av) 5 a peak repetitive forward current (rated v r , square wave, 20 khz) t c = 171 c i frm 10 a nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 105 a operating junction and storage temperature range (note 1) t j , t stg ? 65 to +175 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. the heat generated must be less than the thermal conductivity from junction ? to ? ambient: dp d /dt j < 1/r ja . schottky barrier rectifier 5 amperes, 100 volts http://onsemi.com see detailed ordering and shipping information in the package dimensions sect ion on page 2 of this data sheet. ordering information marking diagram dpak case 369c 1 2 3 4 yww b 5100g y = year ww = work week b5100 = device code g = pb ? free package 1 3 4 (pin 1: no connect)
mbrd5h100t4g http://onsemi.com 2 thermal characteristics characteristic symbol value unit thermal resistance, ? junction ? to ? case (note 2) ? junction ? to ? ambient (note 2) r jc r ja 1.6 95.8 c/w 2. when mounted using minimum recommended pad size on fr ? 4 board. electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (note 3) (i f = 5 a, t j = 25 c) (i f = 5 a, t j = 125 c) v f 0.71 0.60 v maximum instantaneous reverse current (note 3) (rated dc voltage, t j = 125 c) (rated dc voltage, t j = 25 c) i r 4.5 3.5 ma a 3. pulse test: pulse width = 300 s, duty cycle 2.0% ordering information device package shipping ? mbrd5h100t4g dpak (pb ? free) 2500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mbrd5h100t4g http://onsemi.com 3 if, instantaneous forward current (a) vf, instantaneous forward voltage (v) 0.1 1 10 100 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 125 c 150 c 25 c figure 1. typical forward voltage 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.1 1 10 100 if, instantaneous forward current (a) 125 c 150 c 25 c figure 2. maximum forward voltage vf, instantaneous forward voltage (v) ir, reverse current (ma) 0.00001 0.0001 0.001 0.01 0.1 1 10 0102030405060708090100 25 c 125 c 150 c 0.0001 0.001 0.01 0.1 1 10 100 0102030405060708090100 figure 3. typical reverse current figure 4. maximum reverse current vr, reverse voltage (v) ir, reverse current (ma) vr, reverse voltage (v) 125 c 150 c 25 c 0 20 40 60 80 100 0 200 400 600 800 1000 1200 t j = 25 c f = 1 mhz c, capacitance (pf) figure 5. typical capacitance vr, reverse voltage (v) 160 t c , case temperature ( c) 8 7 5 6 4 i f(av) , average forward current (a) 3 2 1 145 150 155 180 0 figure 6. current derating, case 9 10 square 165 170 175 dc r jc = 1.6 c/w
mbrd5h100t4g http://onsemi.com 4 t a , ambient temperature ( c) 120 180 0 2 1 0 140 20 60 80 3 5 i f(av) , average forward current (a) figure 7. current derating, ambient dc square wave 0.1 0.00001 pulse time (s) 100 10 0.1 0.01 0.001 0.0001 0.001 0.01 1.0 10 100 0.000001 50% (duty cycle) 20% 10% 5.0% 2.0% 1.0% single pulse 1000 10 15 05 20 4 2 0 6 8 10 12 i f(av) , average forward current (a) figure 8. forward power dissipation square wave dc p f(av) , average power dissipation (w) r(t) (c/w) figure 9. thermal response, junction ? to ? case 1.0 4 40 100 160 14 16 18 20 22 r ja = 95.8 c/w
mbrd5h100t4g http://onsemi.com 5 package dimensions dpak (single gauge) case 369c ? 01 issue d b d e b3 l3 l4 b2 e m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within dimensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.108 ref 2.74 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. sc illc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems in tended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hol d scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding th e design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resa le in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mbrd5h100/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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